Jb Technical Support Service
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JB Technical Support Service LLC, based in Phoenix, AZ, specializes in advanced bonding solutions with a strong emphasis on customer service and rapid response times. The company offers a range of high-precision equipment including the FC300 High Force Die Flip Chip Bonder and the FC150 Automated Device Bonder, designed for applications in semiconductor and optoelectronics industries.
With a commitment to innovation and reliability, JB Technical Support provides unparalleled service and expertise in the North American market. Their offerings include high accuracy die bonding, nanoimprinting lithography, and various bonding techniques tailored to meet the evolving needs of their clients.
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